Self aligned contact scheme

ABSTRACT

An embodiment is a method including forming a first gate over a substrate, the first gate having first gate spacers on opposing sidewalls, forming a first hard mask layer over the first gate, forming a second hard mask layer over the first hard mask layer, the second hard mask layer having a different material composition than the first hard mask layer, forming a first dielectric layer adjacent and over the first gate, etching a first opening through the first dielectric layer to expose a portion of the substrate, at least a portion of the second hard mask layer being exposed in the first opening, filling the first opening with a conductive material, and removing the second hard mask layer and the portions of the conductive material and first dielectric layer above the first hard mask layer to form a first conductive contact in the remaining first dielectric layer.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a continuation of U.S. patent application Ser. No.15/090,341, entitled “Self Aligned Contact Scheme,” filed on Apr. 4,2016, which application is hereby incorporated herein by reference.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as personal computers, cell phones, digital cameras, and otherelectronic equipment, as examples. Semiconductor devices are typicallyfabricated by sequentially depositing insulating or dielectric layers,conductive layers, and semiconductive layers of material over asemiconductor substrate, and patterning the various material layersusing lithography to form circuit components and elements thereon.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallow more components to be integrated into a given area.

In particular, as designs shrink, conductive features connecting tolayers above and below may become shorted if the conductive feature ismisaligned. Generally, this occurs when the etching process through thelayer is misaligned such that the conductive feature exposes portions ofan adjacent conductive feature on the layer below.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1 through 16 illustrate cross-sectional views of intermediatestages in the manufacturing of a semiconductor device in accordance withsome embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Embodiments will be described with respect to a specific context, namelya self-alignment scheme between two layers. Other embodiments may alsobe applied, however, to align three or more layers. In some embodiments,the self-alignment scheme utilizes multiple mask layers overlyingconductive features of the lower layers to protect the conductivefeatures from unintended exposure during contact opening etchingprocesses. In some embodiments, at least one of the multiple mask layersare metal nitride or metal oxide mask layers and provide sufficientprotection and etch selectivity during the contact opening etchingprocesses.

Some embodiments discussed herein are discussed in the context offield-effect transistors (FETs) formed using a gate-last process. Inother embodiments, a gate-first process may be used. Also, someembodiments contemplate aspects used in planar devices, such as planarFETs, or fin devices, such as FinFETs.

With reference to FIG. 1, FIG. 1 illustrates a substrate 20, dummy gatestacks 28A and 28B, and source/drain regions 30. The substrate 20 may bea semiconductor substrate, such as a bulk semiconductor, asemiconductor-on-insulator (SOI) substrate, or the like, which may bedoped (e.g., with a p-type or an n-type dopant) or undoped. Thesubstrate 20 may be a wafer, such as a silicon wafer. Generally, an SOIsubstrate comprises a layer of a semiconductor material formed on aninsulator layer. The insulator layer may be, for example, a buried oxide(BOX) layer, a silicon oxide layer, or the like. The insulator layer isprovided on a substrate, typically a silicon or glass substrate. Othersubstrates, such as a multi-layered or gradient substrate may also beused. In some embodiments, the semiconductor material of the substrate20 may include silicon; germanium; a compound semiconductor includingsilicon carbide, gallium arsenic, gallium phosphide, indium phosphide,indium arsenide, and/or indium antimonide; an alloy semiconductorincluding SiGe, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP, and/or GaInAsP; orcombinations thereof.

Appropriate wells may be formed in the substrate 20. For example, a Pwell may be formed in the first region of the substrate 20, and an Nwell may be formed in a second region of the substrate 20.

The different implant steps for the different wells may be achievedusing a photoresist or other masks (not shown). For example, aphotoresist is formed and patterned to expose the region the substrate20 to be implanted. The photoresist can be formed by using a spin-ontechnique and can be patterned using acceptable photolithographytechniques. Once the photoresist is patterned, an n-type impurity and/ora p-type impurity implant is performed in the exposed region, and thephotoresist may act as a mask to substantially prevent the impuritiesfrom being implanted into the masked region. The n-type impurities maybe phosphorus, arsenic, or the like implanted in the first region to aconcentration of equal to or less than 10¹⁸ cm⁻³, such as in a rangefrom about 10¹⁷ cm⁻³ to about 10¹⁸ cm⁻³. The p-type impurities may beboron, BF₂, or the like implanted in the first region to a concentrationof equal to or less than 10¹⁸ cm⁻³, such as in a range from about 10¹⁷cm⁻³ to about 10¹⁸ cm⁻³. After the implant, the photoresist is removed,such as by an acceptable ashing process.

After the implants of the wells, an anneal may be performed to activatethe p-type and/or n-type impurities that were implanted. In someembodiments, substrate 20 may include epitaxially grown regions that maybe in situ doped during growth, which may obviate the implantations,although in situ and implantation doping may be used together.

The substrate 20 may include active and passive devices (not shown inFIG. 1). As one of ordinary skill in the art will recognize, a widevariety of devices such as transistors, capacitors, resistors,combinations of these, and the like may be used to generate thestructural and functional requirements of the semiconductor device. Thedevices may be formed using any suitable methods. Only a portion of thesubstrate 20 is illustrated in the figures, as this is sufficient tofully describe the illustrative embodiments.

The substrate 20 may also include metallization layers (not shown). Themetallization layers may be formed over the active and passive devicesand are designed to connect the various devices to form functionalcircuitry. The metallization layers may be formed of alternating layersof dielectric (e.g., low-k dielectric material) and conductive material(e.g., copper) and may be formed through any suitable process (such asdeposition, damascene, dual damascene, or the like).

In some embodiments, the substrate 20 may one or more fins that protrudeabove and from between neighboring isolation regions. For example, thecross-sectional view of FIG. 1 could be along a longitudinal axis of afin. These one or more fins may be formed in various differentprocesses. In one example, the fins can be formed by etching trenches ina substrate to form semiconductor strips; the trenches can be filledwith a dielectric layer; and the dielectric layer can be recessed suchthat the semiconductor strips protrude from the dielectric layer to formfins. In another example, a dielectric layer can be formed over a topsurface of a substrate; trenches can be etched through the dielectriclayer; homoepitaxial structures can be epitaxially grown in thetrenches; and the dielectric layer can be recessed such that thehomoepitaxial structures protrude from the dielectric layer to formfins. In still another example, heteroepitaxial structures can be usedfor the fins. For example, the semiconductor strips can be recessed, anda material different from the semiconductor strips may be epitaxiallygrown in their place. In an even further example, a dielectric layer canbe formed over a top surface of a substrate; trenches can be etchedthrough the dielectric layer; heteroepitaxial structures can beepitaxially grown in the trenches using a material different from thesubstrate; and the dielectric layer can be recessed such that theheteroepitaxial structures protrude from the dielectric layer to formfins. In some embodiments where homoepitaxial or heteroepitaxialstructures are epitaxially grown, the grown materials may be in situdoped during growth, which may obviate prior and subsequentimplantations although in situ and implantation doping may be usedtogether. Still further, it may be advantageous to epitaxially grow amaterial in an NMOS region different from the material in a PMOS region.In various embodiments, the fins may comprise silicon germanium(Si_(x)Ge_(1-x), where x can be between approximately 0 and 100),silicon carbide, pure or substantially pure germanium, a III-V compoundsemiconductor, a II-VI compound semiconductor, or the like. For example,the available materials for forming III-V compound semiconductorinclude, but are not limited to, InAs, AlAs, GaAs, InP, GaN, InGaAs,InAlAs, GaSb, AlSb, AlP, GaP, and the like.

The gate stacks 28 (including 28A and 28B) are formed over the substrate20. The gate stacks 28 may include a dummy gate dielectric 22, a hardmask (not shown), and a dummy gate electrode 24. The dummy gatedielectric layer (not shown) may be formed by thermal oxidation,chemical vapor deposition (CVD), sputtering, or any other methods knownand used in the art for forming a gate dielectric. In some embodiments,the dummy gate dielectric layer includes dielectric materials having ahigh dielectric constant (k value), for example, greater than 3.9. Thedummy gate dielectric materials include silicon nitrides, oxynitrides,metal oxides such as HfO₂, HfZrO_(x), HfSiO_(x), HfTiO_(x), HfAlO_(x),the like, or combinations and multi-layers thereof.

The dummy gate electrode layer (not shown) may be formed over the dummygate dielectric layer. The gate electrode layer may comprise aconductive material and may be selected from a group comprisingpolycrystalline-silicon (polysilicon), poly-crystallinesilicon-germanium (poly-SiGe), metallic nitrides, metallic silicides,metallic oxides, and metals. In one embodiment, amorphous silicon isdeposited and recrystallized to create polysilicon. The dummy gateelectrode layer may be deposited by physical vapor deposition (PVD),CVD, sputter deposition, or other techniques known and used in the artfor depositing conductive materials. After deposition, a top surface ofthe dummy gate electrode layer usually has a non-planar top surface, andmay be planarized, for example, by a chemical mechanical polishing (CMP)process, prior to patterning of the dummy gate electrode layer or gateetch. Ions may or may not be introduced into the dummy gate electrodelayer at this point. Ions may be introduced, for example, by ionimplantation techniques.

A hard mask layer (not shown) is formed over the dummy gate electrodelayer. The hard mask layer may be made of SiN, SiON, SiO₂, the like, ora combination thereof. The hard mask layer is then patterned. Thepatterning of the hard mask layer may be accomplished by depositing maskmaterial (not shown) such as photoresist over the hard mask layer. Themask material is then patterned and the hard mask layer is etched inaccordance with the pattern to form hard masks. The dummy gate electrodelayer and the dummy gate dielectric layer may be patterned to form thedummy gate electrodes 24 and dummy gate dielectrics 22, respectively.The gate patterning process may be accomplished by using the hard masksas a pattern and etching the dummy gate electrode layer and the dummygate dielectric layer to form the gate stacks 28.

After the formation of the gate stacks 28, source/drain regions 30 maybe formed in the substrate 20. The source/drain regions 30 may be dopedby performing an implanting process to implant appropriate dopants tocomplement the dopants in the substrate 20. In another embodiment, thesource/drain regions 30 may be formed by forming recesses (not shown) insubstrate 20 and epitaxially growing material in the recesses. Thesource/drain regions 30 may be doped either through an implantationmethod as discussed above, or else by in-situ doping as the material isgrown. In this embodiment, epitaxial source/drain regions 30 may includeany acceptable material, such as appropriate for n-type FETs and/orp-type FETs. For example, in an n-type configuration, if the substrate20 is silicon, the epitaxial source/drain regions 30 may includesilicon, SiC, SiCP, SiP, or the like. For example, in an n-typeconfiguration, if the substrate 20 is silicon, the epitaxialsource/drain regions 30 may comprise SiGe, SiGeB, Ge, GeSn, or the like.The epitaxial source/drain regions 30 may have surfaces raised above topsurfaces of the substrate 20 and may have facets.

In an embodiment, the gate stacks 28 and the source/drain regions 30 mayform transistors, such as metal-oxide-semiconductor FETs (MOSFETs). Inthese embodiments, the MOSFETs may be configured in a PMOS or an NMOSconfiguration. In a PMOS configuration, the substrate 20 is doped withn-type dopants and the source/drain regions 30 are doped with p-typedopants. In an NMOS configuration, the substrate is doped with p-typedopants and the source/drain regions 30 are doped with n-type dopants.

Gate spacers 26 are formed on opposite sides of the gate stacks 28. Thegate spacers 26 are formed by blanket depositing a spacer layer (notshown) on the previously formed gates stacks 28. In an embodiment, thegate spacers 26 include a spacer liner (not shown). The spacer liner maybe made of SiN, SiC, SiGe, oxynitride, oxide, the like, or a combinationthereof. The spacer layer may comprise SiN, oxynitride, SiC, SiON,oxide, combinations thereof, or the like and may be formed by methodsutilized to form such a layer, such as CVD, plasma enhanced CVD (PECVD),low pressure CVD (LPCVD), atomic layer deposition (ALD), sputter, thelike, or a combination thereof. The gate spacers 26 are then patterned,for example, by an anisotropic etch to remove the spacer layer fromhorizontal surfaces, such as top surfaces of the gate stacks 28 and atop surface of the substrate 20.

In another embodiment, the source/drain regions 30 may include a lightlydoped region (sometimes referred to as a LDD region) and a heavily dopedregion. In this embodiment, before the gate spacers 26 are formed, thesource/drain regions 30 lightly doped with an implantation process usingthe gate stacks 28 as masks. After the gate spacers 26 are formed, thesource/drain regions 30 may then be heavily doped with an implantationprocess using the gate stacks 28 and gate spacers 26 as masks. Thisforms lightly doped regions and heavily doped regions. The lightly dopedregions are primarily underneath the gate spacers 26 while the heavilydoped regions are outside of the gate spacers along the substrate 20.

Although the description above described the formation of gates 28, thestructures 28 are not limited to gates. In some embodiments, thestructures 28 are conductive lines 28 that are to be aligned and coupledwith other conductive features by subsequently formed conductivefeatures.

As illustrated in FIG. 1, the gate stack 28B has a width that is greaterthan the widths of the dummy gate stacks 28A. In addition, the pitchbetween the dummy gate stack 28B and the nearest dummy gate stack 28A islarger than the pitch between the dummy gate stacks 28A. The locationsof these different types of gate stacks 28 are to illustrate variousconfigurations of the disclosed embodiments and the locations of thevarious gate stacks 28 are not limited to these exact locations.

FIG. 2 illustrates the formation of an etch stop layer 32 over thesubstrate 20, the gate stacks 28, the gate spacers 26, and thesource/drain regions 30. The etch stop layer 32 may be conformallydeposited over components on the substrate 20. In some embodiments, theetch stop layer 32 may be silicon nitride, silicon carbide, siliconoxide, low-k dielectrics such as carbon doped oxides, extremely low-kdielectrics such as porous carbon doped silicon dioxide, the like, or acombination thereof, and deposited by CVD, PVD, ALD, aspin-on-dielectric process, the like, or a combination thereof.

In FIG. 3, an interlayer dielectric (ILD) 34 is deposited over thestructure illustrated in 2. In an embodiment, the ILD 34 is a flowablefilm formed by a flowable CVD. In some embodiments, the ILD 34 is formedof oxides such as silicon oxide, Phospho-Silicate Glass (PSG),Boro-Silicate Glass (BSG), Boron-Doped Phospho-Silicate Glass (BPSG),undoped Silicate Glass (USG), low-k dielectrics such as carbon dopedoxides, extremely low-k dielectrics such as porous carbon doped silicondioxide, a polymer such as polyimide, the like, or a combinationthereof. The low-k dielectric materials may have k values lower than3.9. The ILD 34 may be deposited by any suitable method such as by CVD,ALD, a spin-on-dielectric (SOD) process, the like, or a combinationthereof.

Further in FIG. 3, a planarization process, such as a CMP process, maybe performed to level the top surface 34S of the ILD 34 with topsurfaces 24S of the dummy gates electrodes 24 and top surfaces 32S ofthe etch stop layer 32. The CMP process may also remove the hard masks,if present, on the dummy gates electrodes 24. Accordingly, top surfaces24S of the dummy gates electrodes 24 are exposed through the ILD 34.

In FIG. 4, the dummy gate electrodes 24 and the dummy gate dielectrics22 directly underlying the dummy gate electrodes 24 are removed in anetching step(s), so that recesses 36 are formed. Each recess 36 exposesa channel region of a respective FET in the embodiment where MOSFETs arebeing formed. Each channel region is disposed between neighboring pairsof source/drain regions 30. During the removal, the dummy gatedielectrics 22 may be used as an etch stop layer when the dummy gateelectrodes 24 are etched. The dummy gate dielectrics 22 may then beremoved after the removal of the dummy gate electrodes 24 The recesses36 are defined by the exposed surfaces 20S of the substrate 20 andexposed inner surfaces 26S of the gate spacers 26.

In FIG. 5, gate dielectric layers 38 and gate electrodes 40 are formedfor replacement gates. The gate dielectric layers 38 are depositedconformally in recesses 36, such as on the top surface of the substrateand on sidewalls of the gate spacers 26, and on a top surface of the ILD34. In accordance with some embodiments, gate dielectric layers 38comprise silicon oxide, silicon nitride, or multilayers thereof. Inother embodiments, gate dielectric layers 38 include a high-k dielectricmaterial, and in these embodiments, gate dielectric layers 38 may have ak value greater than about 7.0, and may include a metal oxide or asilicate of Hf, Al, Zr, La, Mg, Ba, Ti, Pb, and combinations thereof.The formation methods of gate dielectric layers 38 may includemolecular-beam deposition (MBD), ALD, PECVD, and the like.

Next, gate electrodes 40 are deposited over gate dielectric layers 38,respectively, and fill the remaining portions of the recesses 36. Gateelectrodes 40 may be made of a metal-containing material such as TiN,TaN, TaC, Co, Ru, Al, combinations thereof, or multi-layers thereof.After the filling of gate electrodes 40, a planarization process, suchas a CMP process, may be performed to remove the excess portions of gatedielectric layers 38 and the material of gate electrodes 40, whichexcess portions are over the top surface of ILD 34. The resultingremaining portions of material of gate electrodes 40 and gate dielectriclayers 38 thus form replacement gates 42 (including replacement gates42A and 42B).

In a complementary MOS (CMOS) embodiment with both NMOS and PMOS deviceson the substrate 20, the formation of the gate dielectric layers 38 inboth the PMOS and NMOS regions may occur simultaneously such that thegate dielectric layers 38 in both the PMOS and NMOS regions are made ofthe same materials, and the formation of the gate electrodes 40 in boththe PMOS and NMOS regions may occur simultaneously such that the gateelectrodes 40 in both the PMOS and NMOS regions are made of the samematerials. However, in other embodiments, the gate dielectric layers 38in the NMOS region and the PMOS region may be formed by distinctprocesses, such that the gate dielectric layers 38 in the NMOS regionand the PMOS region may be made of different materials, and the gateelectrodes 40 in the NMOS region and the PMOS region may be formed bydistinct processes, such that the gate electrodes 40 in the NMOS regionand the PMOS region may be made of different materials. Various maskingsteps may be used to mask and expose appropriate regions when usingdistinct processes.

In FIG. 6, the gate electrodes 40 and the gate dielectrics 38 arerecessed in an etching step(s), so that recesses 44 are formed. Therecesses 44 allow for subsequently formed hard masks to be formed withinthe recesses 44 to protect the replacement gates 42. The recesses 44 aredefined by the exposed inner surfaces 26S of the gate spacers 26 and therecessed top surfaces 40S and 38S of the gate electrodes 40 and gatedielectrics 38, respectively.

Further, the bottom surfaces of the recesses 44 may have a flat surfaceas illustrated, a convex surface, a concave surface (such as dishing),or a combination thereof. The bottom surfaces of the recesses 44 may beformed flat, convex, and/or concave by an appropriate etch. The gateelectrodes 40 and the gate dielectrics 38 may be recessed using anacceptable etching process, such as one that is selective to thematerials of the gate electrodes 40 and the gate dielectrics 38.

In FIG. 7, a first hard mask layer 46 is formed over the ILD 34 andwithin the recesses 44 over gate electrodes 40 and the gate dielectrics38. The first hard mask layer 46 may be made of SiN, SiON, SiO₂, thelike, or a combination thereof. The first hard mask layer 46 may beformed by CVD, PVD, ALD, a spin-on-dielectric process, the like, or acombination thereof. The formation of the first hard mask layer 46within the recesses 44 may cause seams and/or voids 48 to be formedwithin the first hard mask layer 46 due to the aspect ratio of therecesses at the smaller technology nodes such as nodes at 10 nm or less.These seams and/or voids 48 can be weak points within the first hardmask layer 46 that may allow for the gate electrodes 40 and/or the gatedielectrics 38 to be unintentionally exposed during a subsequent etchingprocess.

FIG. 8 illustrates recessing the first hard mask layer 46 to formrecesses 50. In some embodiments, the first hard mask layer 46, the etchstop layer 32, and the gate spacers 26 are recessed such that topsurfaces 46S, 26T, and 32S of the first hard mask layer 46, the etchstop layer 32, and the gate spacers 26, respectively, are below topsurfaces 34S of the ILD 34. In some embodiments, the recessing of thefirst hard mask layer 46 completely removes the seams and/or voids 48 inthe first hard mask layer 46, and, in other embodiments, at least aportion of the seams and/or voids 48 remains after the recessingprocess.

Further, the bottom surfaces of the recesses 50 may have a flat surfaceas illustrated, a convex surface, a concave surface (such as dishing),or a combination thereof. The bottom surfaces of the recesses 50 may beformed flat, convex, and/or concave by an appropriate etch. The firsthard mask layer 46 may be recessed using an acceptable etching process,such as one that is selective to the materials of the first hard masklayer 46, the etch stop layer 32, and the gate spacer 26. For example,an etch process may include the formation of a reactive species from anetchant gas using a plasma. In some embodiments, the plasma may be aremote plasma. The etchant gas may include a fluorocarbon chemistry suchas C₄F₆/CF₄/C₅F and NF₃/O₂/N₂/Ar/H₃/H₂, the like, or a combinationthereof. In some embodiments, the etchant gas may be supplied to theetch chamber at a total gas flow of from about 100 to about 1000 sccm.In some embodiments, the pressure of the etch chamber during the etchprocess is from about 10 mtorr to about 50 mtorr. In some embodiments,the etchant gas may comprise between about 10 to about 90 percenthydrogen gas. In some embodiments, the etchant gas may comprise betweenabout 20 to about 80 percent inert gas.

In FIG. 9, a second hard mask layer 52 is formed over the first hardmask layer 46, the gate spacers 26, the etch stop layer 32, and the ILD34 and within the recesses 50. The second hard mask layer 52 providesprotection for the first hard mask layer 46, the gate spacers 26, andthe etch stop layer 32 during the subsequent self-aligned contactetching (see FIG. 12) to ensure that the self-aligned contact does notshort one of the gate electrodes 40 to the corresponding source/drainregion 30. The second hard mask layer 52 may be made of a metal, a metaloxide, a metal nitride, pure silicon, the like, or a combinationthereof. Some examples of the metal oxide and metal nitride are TiO,HfO, AlO, ZrO, ZrN, the like, or a combination thereof. The materialcomposition of the second hard mask layer 52 is important as it ensuresa high film density and a non-volatile etching byproduct, such as, forexample a metal fluoride etching byproduct. Further, the materialsavailable for use in the second hard mask layer 52 are larger than thematerials available for use in the first hard mask layer 46 because thesecond hard mask layer 52 will be subsequently removed (see FIG. 15),and thus, these materials will not impact subsequent processing. Thesecond hard mask layer 52 may be formed by CVD, PVD, ALD, aspin-on-dielectric process, the like, or a combination thereof.

In FIG. 10, a planarization process, such as a CMP process, may beperformed to level the top surface 34S of the ILD 34 with top surfaces52S of the second hard mask layer 52. Accordingly, top surfaces 34S ofthe ILD 34 are exposed.

In FIG. 11, an ILD 54 is deposited over the structure illustrated in 10.In an embodiment, the ILD 54 is a flowable film formed by a flowableCVD. In some embodiments, the ILD 54 is formed of oxides such as siliconoxide, PSG, BSG, BPSG, USG, low-k dielectrics such as carbon dopedoxides, extremely low-k dielectrics such as porous carbon doped silicondioxide, a polymer such as polyimide, the like, or a combinationthereof. The low-k dielectric materials may have k values lower than3.9. The ILD 54 may be deposited by any suitable method such as by CVD,ALD, a SOD process, the like, or a combination thereof. In someembodiments, the ILD 54 is planarized by a CMP process or an etchingprocess to form a substantially planar top surface.

Further in FIG. 11, a hard mask layer 56 is formed over the ILD 54 andpatterned. The hard mask layer 56 may be made of SiN, SiON, SiO₂, thelike, or a combination thereof. The hard mask layer 56 may be formed byCVD, PVD, ALD, a SOD process, the like, or a combination thereof. Thehard mask layer 56 is then patterned. The patterning of the hard masklayer 56 may be accomplished by depositing mask material (not shown)such as photoresist over the hard mask layer 56. The mask material isthen patterned and the hard mask layer 56 is etched in accordance withthe pattern to form a patterned hard mask layer 56.

FIG. 12 illustrates the formation of the openings 58A and 58B throughthe ILD 54 and through the ILD 34 using the patterned hard mask layer 56as a mask to expose portions of the substrate 20. In the illustratedembodiment, the openings 58A and 58B expose portions surfaces 30S of thesource/drain regions 30, and, in other embodiments, where thesource/drain regions 30 are not present, the openings 58A and 58B canexpose other features, such as, for example, a metal feature in thesubstrate 20. Although portions of the opening 58A extend over topsurfaces of the gate stacks 42A, the second hard mask layer 52 and theetch stop layer 32 self-align the opening 58A between adjacent pairs ofgate stacks 42A to the substrate 20. In the illustrated embodiment, theopening 58B is not self-aligned as the pitch between the gate stack 42Band the nearest gate stack 42A is larger than the pitch of the gatestacks 42A and self-aligned openings are not necessary for this largerpitch. The openings 58A and 58B may be formed by using acceptableetching techniques. In an embodiment, the openings 58A and 58B areformed by an anisotropic dry etch process. For example, the etchingprocess may include a dry etch process using a reaction gas thatselectively etches ILDs 54 and 34 without etching the second hard masklayer 52. For example, an etch process may include the formation of areactive species from an etchant gas using a plasma. In someembodiments, the plasma may be a remote plasma. The etchant gas mayinclude a fluorocarbon chemistry such as C₄F₆/CF₄/C₅F andNF₃/O₂/N₂/Ar/H₃/H₂, the like, or a combination thereof. In someembodiments, the etchant gas may be supplied to the etch chamber at atotal gas flow of from about 100 to about 1000 sccm. In someembodiments, the pressure of the etch chamber during the etch process isfrom about 10 mtorr to about 50 mtorr. The second hard mask layer 52acts like an etch stop layer and advantageously prevents damage tounderlying features (e.g., gate spacer 26, first hard mask layer 46, andgate stacks 42) even when patterning misalignment errors occur. Absentthe second hard mask layer 52, the gate spacers 26, the first hard masklayers 46, and the gate stacks 42 may be inadvertently damaged by theetching process. In some embodiments, the etching process used for theself-aligned opening 58A may remove some upper portions of the secondhard mask layer 52, but does not completely etch through the second hardmask layer 52 such that the first hard mask layer 46, the gate spacers26, and the covered portions of the etch stop layer 32 are protectedduring the etching process.

In FIG. 13, the hard mask layer 56 is further patterned and opening 58Cis formed through the ILD 54, the second hard mask layer 52 overlyingthe gate stack 42B, and the first hard mask layer 46 overlying the gatestack 42B using the patterned hard mask layer 56 as a mask to expose aportion of the surface 40S of the gate electrode 40 of the gate stack42B. The patterning of the hard mask layer 56 may be accomplished bydepositing mask material (not shown) such as photoresist over the hardmask layer 56. The mask material is then patterned and the hard masklayer 56 is etched in accordance with the pattern to form the patternedhard mask layer 56. The mask material may remain over the openings 58Aand 58B during the formation of the opening 58C to protect thestructures within the openings 58A and 58B. In the illustratedembodiment, the opening 58C is not self-aligned. The opening 58C may beformed by using acceptable etching techniques. In an embodiment, theopening 58C and is formed by an anisotropic dry etch process.

FIG. 14 illustrates the formation of a conductive layer 60 in theopenings 58A, 58B, and 58C. The conductive layer 60 in the opening 58Acontacts the exposed surface of the substrate 20 and is along exposedsurfaces of the etch stop layer 32, the ILDs 34 and 54, and top surfacesof the second hard mask layer. The conductive layer 60 in the opening58B contacts the exposed surface of the substrate 20 and is alongexposed surfaces of the etch stop layer 32 and the ILDs 34 and 54. Inthe illustrated embodiment, the conductive layer 60 in the openings 58Aand 58B contacts the expose surfaces of the source/drain regions 30,and, in other embodiments, where the source/drain regions 30 are notpresent, the conductive layer 60 in the openings 58A and 58B contactsother features, such as, for example, a metal feature in the substrate20. The conductive layer 60 in the opening 58C contacts the exposedsurface of the gate electrode 40 of the gate stack 42B and is alongexposed surfaces of the first and second hard mask layers 46 and 52 andthe ILD 54.

In some embodiments, the conductive layer 60 includes a barrier layer(not shown). The barrier layer helps to block diffusion of thesubsequently formed conductive layer 60 into adjacent dielectricmaterials such as ILDs 34 and 54. The barrier layer may be made oftitanium, titanium nitride, tantalum, tantalum nitride, manganese,manganese oxide, cobalt, cobalt oxide, cobalt nitride, nickel, nickeloxide, nickel nitride, silicon carbide, oxygen doped silicon carbide,nitrogen doped silicon carbide, silicon nitride, aluminum oxide,aluminum nitride, aluminum oxynitride, a polymer such as polyimide,polybenzoxazole (PBO) the like, or a combination thereof. The barrierlayer may be formed by CVD, PVD, PECVD, ALD, SOD, the like, or acombination thereof. In some embodiments, the barrier layer is omitted.

The conductive layer 60 may be made of tungsten, copper, aluminum, thelike, or a combination thereof. The conductive layer 60 may be formedthrough a deposition process such as electrochemical plating, PVD, CVD,the like, or a combination thereof. In some embodiments, the conductivelayer 60 is formed on a copper containing seed layer, such as AlCu.

In some embodiments, the conductive layer 60 is formed to have excessmaterial overlying a top surface of the ILD 54. In these embodiments,the conductive layer 60 is planarized by a grinding process such as aCMP process to form conductive features 60A, 60B, and 60C in theopenings 58A, 58B, and 58C, respectively. In some embodiments, the topsurfaces of the conductive features 60A, 60B, and 60C are level with thetop surface of the ILD 54 after the planarization process.

FIG. 15 illustrates the removal of the ILD 54, the second hard masklayer 52, and the portion of the ILD 34 and conductive features 60A,60B, and 60C at levels above the top surfaces of the first hard masklayer 46. This removal may be performed by one or more etching processesand/or grinding processes such as CMP processes. After the removalprocess, the conductive feature 60A is now two separated conductivefeatures 60A1 and 60A2 and the conductive features 60C is now embeddedin the first hard mask layer 46 overlying the gate stack 42B. Inaddition, after the removal process, the top surfaces of the conductivefeatures 60A1, 60A2, 60B, and 60C are level with the top surface of theILD 34 and the first hard mask layer 46.

FIG. 16 illustrates the formation of an etch stop layer 62 over thestructure of FIG. 15. The etch stop layer 62 is formed over the ILD 34,the etch stop layer 32, the first hard mask layers 46, and the gatespacers 26. The etch stop layer 62 may be conformally deposited overthese components. In some embodiments, the etch stop layer 62 may besilicon nitride, silicon carbide, silicon oxide, low-k dielectrics suchas carbon doped oxides, extremely low-k dielectrics such as porouscarbon doped silicon dioxide, the like, or a combination thereof, anddeposited by CVD, PVD, ALD, a spin-on-dielectric process, the like, or acombination thereof.

Further in FIG. 16, an ILD 64 is deposited over the etch stop layer 62.In an embodiment, the ILD 64 is a flowable film formed by a flowableCVD. In some embodiments, the ILD 64 is formed of oxides such as siliconoxide, PSG, BSG, BPSG, USG, low-k dielectrics such as carbon dopedoxides, extremely low-k dielectrics such as porous carbon doped silicondioxide, a polymer such as polyimide, the like, or a combinationthereof. The low-k dielectric materials may have k values lower than3.9. The ILD 64 may be deposited by any suitable method such as by CVD,ALD, a SOD process, the like, or a combination thereof.

Further in FIG. 16, contacts 66A1, 66A2, 66B, and 66C are formed throughthe ILD 64 and the etch stop layer 62 to electrically and physicallycontact respective contacts 60A1, 60A2, 60B, and 60C. The openings forthe contacts 66 may be formed by using acceptable etching techniques. Inan embodiment, the openings are formed by an anisotropic dry etchprocess. These openings are filled with a conductive layer 66. In someembodiments, the conductive layer 66 includes a barrier layer (notshown). The barrier layer helps to block diffusion of the subsequentlyformed conductive layer 66 into adjacent dielectric materials such asILD 64 and etch stop layer 62. The barrier layer may be made oftitanium, titanium nitride, tantalum, tantalum nitride, manganese,manganese oxide, cobalt, cobalt oxide, cobalt nitride, nickel, nickeloxide, nickel nitride, silicon carbide, oxygen doped silicon carbide,nitrogen doped silicon carbide, silicon nitride, aluminum oxide,aluminum nitride, aluminum oxynitride, a polymer such as polyimide, PBOthe like, or a combination thereof. The barrier layer may be formed byCVD, PVD, PECVD, ALD, SOD, the like, or a combination thereof. In someembodiments, the barrier layer is omitted.

The conductive layer 66 may be made of tungsten, copper, aluminum, thelike, or a combination thereof. The conductive layer 66 may be formedthrough a deposition process such as electrochemical plating, PVD, CVD,the like, or a combination thereof. In some embodiments, the conductivelayer 66 is formed on a copper containing seed layer, such as AlCu.

In some embodiments, the conductive layer 66 is formed to have excessmaterial overlying a top surface of the ILD 64. In these embodiments,the conductive layer 66 is planarized by a grinding process such as aCMP process to form conductive features 66A1, 66A2, 66B, and 66C. Insome embodiments, the top surfaces of the conductive features 66A1,66A2, 66B, and 66C are level with the top surface of the ILD 64 afterthe planarization process.

Embodiments of the present disclosure may achieve advantages, namely aself-alignment scheme between two layers that allows for protection ofthe underlying features. In some embodiments, the self-alignment schemeutilizes multiple mask layers overlying conductive features of the lowerlayers to protect the conductive features from unintended exposureduring contact opening etching processes. In some embodiments, at leastone of the multiple mask layers are a metal nitride or a metal oxidemask layer and provide sufficient protection and etch selectivity duringthe self-aligned contact opening etching processes. In a FET embodimentwith two hard mask layers, the upper hard mask layer made of metalnitride or metal oxide ensures that the self-aligned contact does notshort one of the gate electrodes to the corresponding source/drainregion. In addition, in some embodiments, the lower hard mask layer isrecessed before the application of the upper hard mask layer, and thisrecessing of the lower hard mask layer may substantially if notcompletely remove any seams and/or voids in the lower hard mask layer.Further, the material composition of the upper hard mask layer isimportant as it ensures a high film density and a non-volatile etchingbyproduct, such as, for example a metal fluoride etching byproduct. Evenfurther, the materials available for use in the upper hard mask layerare larger than the materials available for use in the lower hard masklayer because the upper hard mask layer will be subsequently removed,and thus, its materials will not impact subsequent processing.

An embodiment is a method including forming a first gate over asubstrate, the first gate having first gate spacers on opposingsidewalls of the first gate, forming a first hard mask layer over thefirst gate, forming a second hard mask layer over the first hard masklayer, the second hard mask layer having a different materialcomposition than the first hard mask layer, forming a first dielectriclayer adjacent and over the first gate, etching a first opening throughthe first dielectric layer to expose a portion of the substrate, atleast a portion of the second hard mask layer being exposed in the firstopening, filling the first opening with a conductive material, andremoving the second hard mask layer and the portions of the conductivematerial and first dielectric layer above the first hard mask layer toform a first conductive contact in the remaining first dielectric layer.

Another embodiment is a method including forming a first metal gate anda second metal gate over a substrate, the first metal gate and thesecond metal gate each having gate spacers on opposing sidewalls of therespective metal gates, forming a first dielectric layer over thesubstrate and adjacent the first and second metal gates, recessing thefirst metal gate and the second metal gate to have top surfaces below atop surface of a the first dielectric layer, forming a first hard masklayer on the recessed top surfaces of the first metal gate and thesecond metal gate, recessing the first hard mask layer to have topsurfaces below the top surface of the first dielectric layer, forming asecond hard mask layer on the recessed top surfaces of the first hardmask layer, the second hard mask layer having a different materialcomposition than the first hard mask layer, and planarizing the secondhard mask layer to have a top surface coplanar with the top surface ofthe first dielectric layer.

A further embodiment is a structure including a first gate stack on asubstrate, the first gate stack comprising a first high-k gatedielectric layer and a first metal gate electrode, a first hard masklayer on the first gate stack, a first set of gate spacers on opposingsidewalls of the first gate stack and the first set of gate spacers, afirst etch stop layer on sidewalls of the first set of gate spacers, afirst interlayer dielectric surrounding the first etch stop layer andthe first gate stack, the first interlayer dielectric contacting atleast a portion of the first etch stop layer, a first conductive contactextending through the first interlayer dielectric to contact a topsurface of the substrate, the first conductive contact having sidewallscontacting sidewalls of the first etch stop layer, a second etch stoplayer over and contacting top surfaces of the first etch stop layer, thefirst set of gate spacers, the first hard mask layer, and the firstinterlayer dielectric, a second interlayer dielectric over the secondetch stop layer, and a second conductive contact extending through thesecond interlayer dielectric and the second etch stop layer to contactthe first conductive contact.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: forming a first gate over asubstrate; forming a first dielectric layer over the substrate andsurrounding the first gate; forming a first hard mask layer over thefirst gate; forming a second hard mask layer over the first hard masklayer; planarizing the second hard mask layer to have a top surfacelevel with a top surface of the first dielectric layer; forming a seconddielectric layer over the first gate and the first dielectric layer;etching a first opening through the second dielectric layer and thefirst dielectric layer to expose a portion of the substrate; filling thefirst opening with a conductive material; and recessing the second hardmask layer, the conductive material, and the second dielectric layer tolevel top surfaces of the first hard mask layer, the conductivematerial, and the first dielectric layer, the recessed conductivematerial forming a first conductive contact.
 2. The method of claim 1further comprising: first gate spacers on opposing sidewalls of thefirst gate and the first hard mask layer.
 3. The method of claim 2,wherein the second hard mask layer is on top surfaces of the first gatespacers.
 4. The method of claim 1, wherein the second hard mask layercomprises a metal nitride or a metal oxide.
 5. The method of claim 4,wherein the second hard mask layer comprises TiO, HfO, AlO, ZrO, ZrN, ora combination thereof.
 6. The method of claim 1, wherein forming thefirst gate over the substrate comprises: forming a first dummy gate overthe substrate, the first dummy gate comprising a first dummy gatedielectric on the substrate and a first dummy gate electrode on thefirst dummy gate dielectric; forming first gate spacers on opposingsidewalls of the first dummy gate; forming source/drain regions in thesubstrate using the first dummy gate and first gate spacers as a mask;forming a first etch stop layer over the substrate, the first dummygate, and the first gate spacers; forming the first dielectric layerover the first etch stop layer; planarizing the first dielectric layerto expose a portion of the first dummy gate; and replacing the firstdummy gate with the first gate.
 7. The method of claim 1 furthercomprising: recessing the first gate to have a top surface below the topsurface the first dielectric layer, the first hard mask layer beingformed on the recessed top surface of the first gate; and recessing thefirst hard mask layer to have a top surface below the top surface of thefirst dielectric layer, the second hard mask layer being formed on therecessed top surface of the first hard mask layer.
 8. The method ofclaim 1 further comprising: after recessing the second hard mask layer,the conductive material, and the second dielectric layer, forming athird dielectric layer over the first hard mask layer and the firstdielectric layer; and forming a second conductive contact through thethird dielectric layer to the first conductive contact.
 9. The method ofclaim 8, wherein a bottom surface of the second conductive contactcontacts a top surface of the first hard mask layer and a top surface ofthe first conductive contact.
 10. A method comprising: forming a firstmetal gate over a substrate, the first metal gate having first gatespacers on opposing sidewalls of the first metal gate; forming a firstdielectric layer over the substrate and adjacent the first metal gate;recessing the first metal gate to have a top surface below a top surfaceof a the first dielectric layer; forming a first hard mask layer on therecessed top surface of the first metal gate; recessing the first hardmask layer and the first gate spacers to have top surfaces below the topsurface of the first dielectric layer; and forming a second hard masklayer on the recessed top surfaces of the first hard mask layer and thefirst gate spacers.
 11. The method of claim 10 further comprising:planarizing the second hard mask layer to have a top surface level withthe top surface of the first dielectric layer.
 12. The method of claim10, wherein the second hard mask layer comprises a metal nitride or ametal oxide.
 13. The method of claim 10, wherein the first metal gatecomprises a high-k gate dielectric layer on the substrate and alonginner sidewalls of the first gate spacers and a metal gate electrode onthe high-k gate dielectric layer.
 14. The method of claim 10 furthercomprising: forming a second dielectric layer over the second hard masklayer and first hard mask layer; etching a first opening through thesecond and first dielectric layers to expose a portion of the substrate,at least a portion of the second hard mask layer overlying the firstmetal gate being exposed in the first opening; filling the first openingwith a conductive material; and removing the second dielectric layer andthe second hard mask layer and the portions of the conductive materialand second and first dielectric layer above the first hard mask layer toform a first conductive contact in the first dielectric layer.
 15. Themethod of claim 14, wherein an entire top surface of the second hardmask layer overlying the first metal gate is exposed in the firstopening.
 16. The method of claim 14 further comprising: after removingthe second dielectric layer and the second hard mask layer and theportions of the conductive material and second and first dielectriclayer above the first hard mask layer, forming a third dielectric layerover the first hard mask layer and the first dielectric layer; andforming a second conductive contact through the third dielectric layerto the first conductive contact.
 17. A method comprising: forming afirst gate and a second gate over a substrate, the first gate and thesecond gate each having gate spacers on opposing sidewalls of therespective gates; forming a first dielectric layer over the substrateand surrounding the first gate and the second gate; forming a first hardmask layer and a second hard mask layer over the first gate and thesecond gate; forming a second dielectric layer over the second hard masklayer and the first dielectric layer; etching a first opening throughthe second dielectric layer and the first dielectric layer to expose aportion of the substrate adjacent the first gate, at least a portion ofthe gate spacers on the sidewall of the first gate exposed in the firstopening; and etching a second opening through the second dielectriclayer and the first dielectric layer to expose a portion of thesubstrate adjacent the second gate, the gate spacers on the sidewall ofthe second gate not being exposed in the second opening.
 18. The methodof claim 17 further comprising: recessing the first gate and the secondgate to have top surfaces below a top surface the first dielectriclayer, the first hard mask layer being formed on the recessed topsurfaces of the first gate and the second gate; and recessing the firsthard mask layer to have a top surface below the top surface of the firstdielectric layer, the second hard mask layer being formed on therecessed top surfaces of the first hard mask layer.
 19. The method ofclaim 18 further comprising: filling the first opening and secondopening with a conductive material; and removing the second dielectriclayer and the second hard mask layer and the portions of the conductivematerial and first dielectric layer above the first hard mask layer toform a first conductive contact in the remaining first opening and asecond conductive contact in the remaining second opening.
 20. Themethod of claim 19 further comprising: forming a third dielectric layerover the first hard mask layer and the first dielectric layer; andforming a third conductive contact through the third dielectric layer tothe first conductive contact.